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Kester NXG1 Lead Free No-Clean Solder Paste 600 Gr. Cartridge (Kester Part No. 70-3213-0811)

Kester NXG1 Lead Free No-Clean Solder Paste 600 Gr. Cartridge (Kester Part No. 70-3213-0811)

NXG1 is a lead-free, air and nitrogen reflowable no-clean solder paste specifically designed for the thermal requirements of lead free alloys. Compatible to lead free alloys including Sn96.5Ag3.0Cu0.5. The residue does not need to be removed for typical applications. NXG1 has a lengthy 8 month shelf life.

Features:
• No-clean formula does not leave a residue ( typical applications)
• Produce smooth, shiny joints that closely resemble those achieved with SN/PB solder paste
• Long stencil and tack life (process dependent)
• Excellent release from stencil
• Capable of 120 minute break times in printing
• Refrigeration required
• Select the UPS shipping option

NXG1 Specifications
• Alloy: Sn96.5Ag3.0Cu0.5
• Metals: 88.5%
• Flux type: no-clean
• Mesh: -325+500
• Print speeds up to 200 mm/sec (8 in/sec)
• Excellent printing characteristics on 0.4mm (16 mil) pitch QFPs
• Shelf life: 8 months
• RoHs compliant

Transportation Regulations
• Solder paste must be shipped overnight via UPS Red
• Shipments within UPS Zone 2 (NJ zip 07606) can ship via UPS ground


Price $126.10